| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board containing a relatively thin metallic core substrate, high-density wiring layers, etc., and to provide a method by which the wiring board can be manufactured accurately and efficiently. <P>SOLUTION: The wiring board 1 comprises the metallic core substrate 2 having a front surface 3 and a rear surface 4, a plurality of insulating layers 8, 16, 22, 9, 15, and 23 respectively formed above the front surface 3 and rear surface 4 of the core substrate 2, and wiring layers 14, 20, 13, and 21 positioned among the insulating layers 8, 16, 22, 9, 15, and 23, The wiring board 1 also comprises through holes 2a formed through the core substrate 2 from the front surface 3 to the rear surface 4 and first via conductors 6 which connect conductor layers 5 formed on the rear surface 4 of the core substrate 2 after passing through the through holes 2a and the wiring layer 14 formed above the front surface 3 of the substrate 2 on which the conductor layers 5 are not formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
