| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a physical security function and high information reliability. <P>SOLUTION: This semiconductor device 100 includes an insulation layer 101, a wiring pattern 102 formed at the insulation layer 101, a via hole conductor 103 which connects between the wiring patterns 102 and a semiconductor 104 which is arranged inside the insulation layer 101 and mounted on the wiring pattern 102. Bonding strength between the insulation layer 101 and the semiconductor 104 is higher than the fracture strength of the semiconductor 104. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
