| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the productivity of packaging parts by efficiently supplying parts for packaging which are a plurality of semiconductor chips supplied from a diced wafer. <P>SOLUTION: The parts packaging device is provided with a substrate holding device for holding a substrate on a substrate holding position, a first packaging head for holding and extracting parts supplied from a first parts supplying position and packaging parts on the substrate held on the substrate holding position, a second packaging head for holding and extracting parts supplied from a second parts supplying position and packaging the extracted parts on the held substrate, a wafer holding table for holding wafer so that respective parts can be supplied, and a parts supply device allowed to be reciprocated between the 1st and 2nd parts supplying positions. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
