| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a deformed wafer is placed on the placing surface of an electrostatic chuck, a strong frictional force occurs between the placing surface and wafer and may generate many particles or may raise the temperature of the wafer by applying heat to the wafer. SOLUTION: In the electrostatic chuck, an insulating film is formed to cover the top surfaces of a pair of adsorption electrodes and circular-arcuate electrodes and comb-shaped electrodes connected to the circular-arcuate electrodes are arranged on the outer peripheral edges of the adsorption electrodes in a state where both comb-shaped electrodes get into the other electrodes. In the electrostatic chuck, the widths of the circular-arcuate electrodes are made narrower than those of the comb-shaped electrodes. In addition, an insulating layer is provided on at least one principal surface of a conductive substrate and the adsorption electrodes are provided on the top surface of the insulating layer. Moreover, the insulating film is provided to cover the adsorption electrodes and the total thickness of the insulating layer and insulating film is adjusted to 20-2,000μm. COPYRIGHT: (C)2005,JPO&NCIPI |
