发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR THE SAME
摘要 PROBLEM TO BE SOLVED: To maintain sufficient strength with which a land 2 and a conductive ball 3 are fixed, and to ensure the fixation of the conductive ball 3 with the land 2 in an electric component that comprises: a circuit element on one surface of an insulation substrate 1 that constitutes an electric component; the land 2 for connecting a terminal that constitutes the circuit element; and the conductive ball 3 that is connected to the land 2. SOLUTION: The land 2 for connecting terminals and the terminals comprising the conductive ball 3 are fixed by a conductive resin 4, wherein the conductive ball 3 is formed of Cu of which the surface is coated with solder. The solder preferably comprises Su alone. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072624(A) 申请公布日期 2005.03.17
申请号 JP20040355105 申请日期 2004.12.08
申请人 MINOWA KOA INC 发明人 TERAOKA HIDEYUKI;TAKAYAMA TOSHIJI;SUZUKI RYUSUKE
分类号 H01L23/12;H01L25/00;(IPC1-7):H01L25/00 主分类号 H01L23/12
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