发明名称 SUBSTRATE-TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate-treating device that does not dispense with an area for arranging a power connection section outside the device and can be changed to the configuration of a horizontal connection and that of a lower connection without raising. SOLUTION: A butt 4 provided at the lowest portion of the substrate-treating device 1 comprises a lower-stage butt 41; and an upper-stage butt 42 that is provided at a position that is one stage higher than the lower-stage butt 41 and has an L-shaped sectional inversion. Since the upper-stage butt 42 is arranged at a one stage higher position than the lower-stage butt 41, space 43 is formed at the lower portion of the upper-stage butt 42. Device piping 15 extended from respective treatment chambers 11-14 passes through the upper-stage butt 42 and the tip reaches the space 43. Additionally, a branch pipe 52 that is subjected to branch connection to utility piping projects from the lower section in the space 43, and the tip of the device piping 15 and that of the branch pipe 52 are connected via an L-shaped connection pipe 53 in the space 43. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072373(A) 申请公布日期 2005.03.17
申请号 JP20030301816 申请日期 2003.08.26
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 TAKI AKIHIKO
分类号 H01L21/306;H01L21/02;H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/306
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