PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve migration resistance properties without working on the composition itself of an insulating base having a circuit layer for composing a printed-wiring board and a cover material having an adhesive layer. SOLUTION: The printed-wiring board (1) is composed by laminating the cover material (21) having the adhesive layer (22) on the insulating base (11) having the circuit layer (14) made of copper. In the printed-wiring board (1), benzotriazole (23) is dipped into the adhesive layer (22). COPYRIGHT: (C)2005,JPO&NCIPI