发明名称 POWER CONVERSION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus which has excellent connecting reliability of a semiconductor module to a control circuit board and which is accurately and easily manufactured. <P>SOLUTION: The power conversion apparatus 1 includes a semiconductor module 2 containing a semiconductor element and having a man electrode terminal 21 and a control electrode terminal 22, a control circuit substrate 3 to which the control electrode terminal 22 of the semiconductor module 2 is connected, a bus assembly 4 composed of a plurality of buses 41 to which the main electrode terminal 21 of the semiconductor module 2 is connected, and a plurality of cooling tubes 5 for cooling the semiconductor module 2 from both sides. A first protrusion part 231 for performing mutual positioning is provided at either one of the semiconductor module 2 and the control circuit substrate 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005073373(A) 申请公布日期 2005.03.17
申请号 JP20030299247 申请日期 2003.08.22
申请人 DENSO CORP 发明人 HARADA DAISUKE
分类号 H01L23/473;H01L25/07;H01L25/18;H02M1/00;H02M7/48 主分类号 H01L23/473
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