发明名称 LIQUID-COOLED SYSTEM AND ELECTRONIC EQUIPMENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a liquid-cooled system which is suitable for a heating part, such as a subminiature semiconductor element, thinned, and releases a large amount of heat and the like, and has long-term corrosion-resistant properties, and to provide electronic equipment using the same. SOLUTION: The liquid-cooled system is equipped with a pump 1 which feeds cooling liquid, a heat receiving jacket 2 where the cooling liquid is supplied and which receives heat from a heating element 6, a radiator 4 where the cooling liquid is supplied through the heat receiving jacket 2 and which radiates heat, and a flow path through which the cooling liquid is circulated through the radiator 4 by the pump 1. An ion-exchange bag 9 composed of an ion-exchange resin and a bag charged with it is provided as a component part of the liquid-cooled system, and furthermore the ion-exchanged bag 9 is set replaceable. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072216(A) 申请公布日期 2005.03.17
申请号 JP20030299430 申请日期 2003.08.25
申请人 HITACHI LTD 发明人 MINAMITANI RINTARO;MATSUSHITA SHINJI;OHASHI SHIGEO;KONDO YOSHIHIRO;OSANAWA TAKASHI;SUZUKI ATSUSHI
分类号 F25D17/02;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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