| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation structure of a power module with which radiation efficiency of heat that a power element emits can be raised. SOLUTION: Heat that MOSFET 11 emits is transmitted to a metal film 22 at a rear side by via holes 20 which are pierced from a surface to the rear face of a substrate 10 through a lead 14 and a pad P3. Consequently, heat transmitted to the metal film 22 is radiated at the metal film 22. Heat that MOSFET 11 emits is also radiated in the pad P3. Thus, heat is radiated in a wide area and therefore radiation efficiency is improved. COPYRIGHT: (C)2005,JPO&NCIPI |
