| 摘要 |
PROBLEM TO BE SOLVED: To simply confirm the existence of adhesion of a silane compound coating in the case that resin adhesion of an electronic component copper or a copper alloy plate or a bar used for a heatsink, a lead frame and the like of a semiconductor device is improved by forming the silane compound coating on the surface. SOLUTION: The manufacturing method immerses the copper or the copper alloy plate or the bar into a mixed liquid containing a silane coupling agent and a pigment substance, and forms the coating comprising a silane compound and the pigment substance on the surface. Since the pigment substance is dispersed in the silane compound coating, the adhesion of the coating can be confirmed by visual observation. An inorganic pigment such as iron oxide and carbon, an organic pigment and a dye and the like can be used. COPYRIGHT: (C)2005,JPO&NCIPI
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