| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided wiring circuit substrate which prevents any defect of a plating layer sufficiently and can realize a wiring pattern of high density, and to provide a manufacturing method of the substrate. SOLUTION: A two-layer substrate 10 is prepared which is formed by sticking an insulating layer 10a to a conductor layer 10b, and a via hole 10V is formed at the predetermined position of the insulating layer 10a. An inside surface of the via hole 10V has an angle of 40 to 70°to the direction of the flat surface of the two-layer substrate 10. The bottom surface of the via hole 10V is sealed by the conductor layer 10b. After that, a metal thin film is formed on the upper surface side of the two-layer substrate 10 by using electroless plating liquid. Electrolytic plating is performed by using the metal thin film as a plating electrode, and a plating layer of predetermine wiring pattern is formed. An etching resist layer is formed at a specified position of the conductor layer 10b. Thus, the conductor layer 10b of a wiring pattern defined beforehand is formed by performing etching. COPYRIGHT: (C)2005,JPO&NCIPI
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