发明名称 LAMINATED BOARD, PACKAGE, AND METHOD OF MANUFACTURING THEM
摘要 PROBLEM TO BE SOLVED: To restrain or eliminate processing defects, such as burrs or chippings, occurring in the cut surfaces of packages which are obtained by dividing a laminated board into some pieces. SOLUTION: Cut grooves 108 are provided in board material sheets, 101, 102, 103, 104, and 105 respectively before a lamination operation is carried out. Especially, when three or more material sheets are laminated, the cut grooves 108 are provided in middle sheet or the third material sheet 103. The board material sheets 101 to 105 are stacked up to form the laminated board 100, a distance between the cut grooves 108 which are provided in the sheets included in the laminated board 100 and adjacent to each other in the direction of thickness becomes short, and a crack opens rectilinearly along a short distance between the adjacent cut grooves in the process of cutting the baked laminated board 100. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072210(A) 申请公布日期 2005.03.17
申请号 JP20030299252 申请日期 2003.08.22
申请人 SONY CORP 发明人 MIYAHARA HIROYUKI
分类号 H01L23/12;H01L23/04;(IPC1-7):H01L23/12 主分类号 H01L23/12
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