发明名称 |
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces |
摘要 |
The present disclosure provides methods and apparatus useful in depositing materials on batches of microfeature workpieces. One implementation provides a method in which a quantity of a first precursor gas is introduced to an enclosure at a first enclosure pressure. The pressure within the enclosure is reduced to a second enclosure pressure while introducing a purge gas at a first flow rate. The second enclosure pressure may approach or be equal to a steady-state base pressure of the processing system at the first flow rate. After reducing the pressure, the purge gas flow may be increased to a second flow rate and the enclosure pressure may be increased to a third enclosure pressure. Thereafter, a flow of a second precursor gas may be introduced with a pressure within the enclosure at a fourth enclosure pressure; the third enclosure pressure is desirably within about 10 percent of the fourth enclosure pressure.
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申请公布号 |
US2005059261(A1) |
申请公布日期 |
2005.03.17 |
申请号 |
US20030665099 |
申请日期 |
2003.09.17 |
申请人 |
BASCERI CEM;DOAN TRUNG T.;WEIMER RONALD A.;BEAMAN KEVIN L.;BREINER LYLE D.;ZHENG LINGYI A.;PING ER-XUAN;SARIGIANNIS DEMETRIUS;KUBISTA DAVID J. |
发明人 |
BASCERI CEM;DOAN TRUNG T.;WEIMER RONALD A.;BEAMAN KEVIN L.;BREINER LYLE D.;ZHENG LINGYI A.;PING ER-XUAN;SARIGIANNIS DEMETRIUS;KUBISTA DAVID J. |
分类号 |
C23C16/34;H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
C23C16/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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