THERMAL CONDUCTIVE MATERIAL UTILIZING ELECTRICALLY CONDUCTIVE NANOPARTICLES
摘要
Thermal interface compositions (10) contain both non-electrically conductive micronsized fillers (18) and electrically conductive nanoparticles (20) blended with a polymer matrix (16). Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles (20) also show less phase separation of micron-sized particles (18) than formulations without nanoparticles (20). Methods for increasing heat transfer include using such compositions between heat producing components (12) and heat sinks (14). Electronic components utilizing such compositions are also disclosed.
申请公布号
WO2005024942(A1)
申请公布日期
2005.03.17
申请号
WO2004US25262
申请日期
2004.08.05
申请人
GENERAL ELECTRIC COMPANY;TONAPI, SANDEEP, SHRIKANT;ZHONG, HONG;SIMONE, DAVIDE, LOUIS;FILLION, RAYMOND, ALBERT
发明人
TONAPI, SANDEEP, SHRIKANT;ZHONG, HONG;SIMONE, DAVIDE, LOUIS;FILLION, RAYMOND, ALBERT