Power semiconductor module for fitting on a heat sink has a casing, power semiconductor components and an insulating substrate with metal layers on both sides

摘要

Power semiconductor components (PSC) (30) fit on a first metal layer (FML) (22) that is structured in itself and consequently forms individual strip conductors. The PSC link to this FML as a circuit. The FML fits on the first main surface of a substrate (20) facing the inside of a power semiconductor module. A second metal layer (24) fits on a second main surface of the substrate.