Surface acoustic wave filter package and fabrication method used the substrate which has solder bumps,申请号KR20020084737-传众专利搜索

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发明名称	Surface acoustic wave filter package and fabrication method used the substrate which has solder bumps
摘要
申请公布号	KR100477477(B1)	申请公布日期	2005.03.17
申请号	KR20020084737	申请日期	2002.12.27
申请人		发明人
分类号	H03H3/08;(IPC1-7):H03H3/08	主分类号	H03H3/08
代理机构		代理人
主权项
地址

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