发明名称 |
SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF |
摘要 |
A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modifie d resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips. |
申请公布号 |
CA2537827(A1) |
申请公布日期 |
2005.03.17 |
申请号 |
CA20042537827 |
申请日期 |
2004.08.03 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
PRABHAKUMAR, ANANTH;GIBSON, DAVID ALEXANDER, III;CAMPBELL, JOHN ROBERT;TONAPI, SANDEEP;RUBINSZTAJN, SLAWOMIR;MILLS, RYAN CHRISTOPHER |
分类号 |
H01L23/29;C01B33/14;C08G59/24;C08G59/62;C08K9/06;C08L63/00;H01L21/56 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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