发明名称 LIGHT EMITTING DIODE DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting diode device that is improved in luminous efficiency, and to provide a method of manufacturing the device. <P>SOLUTION: The light emitting diode device is provided with a substrate, a mixed layer, and first- and second-configuration semiconductor layers. The mixed layer is provided at least a roughened layer to which light rays are made incident in a diffused state. The roughened layer is formed as a thin film of a silicon nitride material or provided with an AlInGaN quantum dot. In the method of manufacturing the light emitting diode device, the mixed layer provided with at least one roughened layer is grown in the course of the epitaxial growth of the light emitting diode device so that the mixed layer may have a light-ray scattering function. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072096(A) 申请公布日期 2005.03.17
申请号 JP20030296635 申请日期 2003.08.20
申请人 SANEN KODEN KOFUN YUGENKOSHI 发明人 KAN HONIN;CHIN RYUKEN
分类号 H01L33/06;H01L33/12;H01L33/32;H01L33/40 主分类号 H01L33/06
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