| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component sealing board excellent in productivity and in electromagnetic noise rejection for use in the manufacture of an electronic device by airtight-sealing an electronic/mechanical microstructure on the semiconductor substrate main surface, and to provide a method for manufacturing an electronic device using the same. <P>SOLUTION: The electronic component sealing board comprises an insulating board 1 with wiring conductors 2 running from one of its main faces to the other or to its side faces, connecting pads 3 formed on one of the main faces of the insulating board 1 and connected to the wiring conductors 2, a framing member 4 formed on one of the main faces of the insulating board 1 for surrounding the connecting pads 3, connecting terminals 5 formed on the connecting pads 3 at the same level as the framing member 4, and a conductor pattern formed as an inductor 12 in the insulating board 1. In the electronic component 10, an electronic/mechanical microstructure 8 is formed and an electrode 9 is connected thereto. The component 10 is mounted with the electrode 9 bonded to one of the connecting terminal 5, and with the main surface of a semiconductor substrate 7 bonded to the main face of the framing member 4, for the airtight sealing of the electronic/mechanical microstructure 8 into the inside of the framing member 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
