| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of being easily and efficiently covered with various kinds of plating layers different in thickness for covering wiring conductors in wiring board regions. SOLUTION: The multiple patterning wiring board has a rectangular shape comprising a plurality of insulation layers stacked in lamination, a plurality of wiring board regions 2 arranged longitudinally and horizontally on the main surface thereof, and patterns formed internally for conducting plating materials that cover the plating layers by the electrolytic plating method. The patterns have first and second inner patterns 4 and 5 formed respectively in different insulation layers, the first and second inner layer patterns 4 and 5 being formed so as to extend perpendicular to each other on the plane when viewed from immediately above and being led out to the different ends of each side of a pair of sides opposite to each other of the rectangle. COPYRIGHT: (C)2005,JPO&NCIPI
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