| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor device and improve the reliability of the semiconductor device. <P>SOLUTION: The semiconductor device is composed of a package substrate 3 on which a plurality of bonding electrodes 3c disposed on the peripheral edge of a main surface 3a and wiring connected to the bonding electrodes 3c are formed and electroless plating is applied to the wiring, a semiconductor chip 1 mounted on the package substrate 3, a plurality of wires 4 for connecting the pad 1a of the semiconductor chip 1 to the bonding electrodes 3c, a sealing material 6 for resin-sealing the semiconductor chip 1 and the wires 4, and a plurality of solder balls 8 provided on the package substrate 3. On the main surface 3a of the package substrate 3, the wiring is formed on only insides of the plurality of bonding electrodes 3c, and solder resist films 3e are not formed on outsides of the plurality of bonding electrodes 3c. By this configuration, the outer region of the bonding electrode 3c is reduced up to the limit, thereby miniaturizing the semiconductor device without changing the size of a chip to be mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
