| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip package where crosstalks of adjacent signals in a carrier layer are reduced. <P>SOLUTION: A first pair of conductors transmitting a first signal is provided in the carrier layer. A second pair of conductors, transmitting a second signal, is provided in the vicinity of the first pair of the conductors in the layer. Here, the first and second conductors are constructed so as to allow the crosstalk between the first pair of the conductors and the second pair of the conductors to be substantially a minimum, without increasing the size of the package, the first pair of the conductors are shorter than the second pair of the conductors. Or, the first pair of the conductors and the second pair of the conductors are constructed so as to allow these conductors to be mutually effected equally. Thus, crosstalks are reduced by the chip package, without impairing the density of the mutual connections inside the package or increasing the size of the package. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
