发明名称 POSITIVE RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition having solubility contrast sufficient for practical use and suppressing pattern collapse, and to provide a method for forming a pattern. <P>SOLUTION: The positive resist composition contains: (A1) a resin component which contains a star branched polymer having polymer chains extending in three or more directions from a lower alkyl molecule, and which shows the solubility with an alkali increased by the effect of an acid, or (A2) a resin component which contains a star branched polymer obtained by polymerization of monomers containing a (meth)acrylic acid ester in the presence of a polyfunctional chain transfer agent having three or more functional groups and which shows the solubility with an alkali increased by the effect of an acid; (B) an acid generating component which generates an acid by exposure; and (C) an organic solvent. The method for forming a resist pattern is carried out by forming a layer comprising the above positive resist composition on a substrate, preliminarily baking the layer, selectively exposing, heating after exposure and developing with an alkali. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005070742(A) 申请公布日期 2005.03.17
申请号 JP20040100205 申请日期 2004.03.30
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IWAI TAKESHI;FUJIMURA SATOSHI;SHIMIZU HIROAKI
分类号 G03F7/039;G03F7/032;H01L21/027 主分类号 G03F7/039
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