发明名称 MICROPLATE
摘要 PROBLEM TO BE SOLVED: To enhance the flatness of the bonding surface with a light pervious plate in a plastic resin plate to which the light pervious plate is bonded to form a microplate. SOLUTION: The outside surfaces of the wells 2 of the resin plate 3 are formed so as to become rougher than the bonding surface of the resin plate 3 with a glass plate 4. Alternatively, the end surface of the opening part of each of the wells 2 on the side, to which the glass plate 4 is not bonded, of the resin plate is formed so as to become rougher than the bonding surface of the resin plate 3 with the glass plate 4. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005069825(A) 申请公布日期 2005.03.17
申请号 JP20030298999 申请日期 2003.08.22
申请人 OLYMPUS CORP;EVOTEC TECHNOLOGIES GMBH 发明人 TERAMOTO SATOSHI;SEKINE KATSUMI;INAHASHI JUN;YAMAZAKI TOSHIKATSU;MICHINAKA AKIO;MATSUO YUTAKA;KODAMA TAKUYA
分类号 G01N21/03;B01L3/00;B29C45/14;B29C45/37;G01N21/25;G01N21/64;(IPC1-7):G01N21/03 主分类号 G01N21/03
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