| 摘要 |
<P>PROBLEM TO BE SOLVED: To simultaneously achieve the improvement of the performance of a semiconductor device equipped with a cooling structure and the miniaturization of the same. <P>SOLUTION: The semiconductor device comprises: (1) a conductive pipe 7 having an internal surface 7IS forming an internal surface constituting a passage for an insulating refrigerant solution 8 and having an external surface 7OS, a part of which constitutes a flat surface part 7OSFR; (2) a power semiconductor element 1 fixed onto the flat surface 7OSFR of the conductive pipe 7 via an adhesive layer 2 such as a solder; (3) a first external connection terminal 6 including an inner lead 6IL having a tip end joined onto the flat surface 7OSFR of the conductive pipe 7 and including an outer lead 6OL connected to the inner lead 6IL; (4) a second external connection terminal 5 floating above the external surface 7OS; and (5) a molding resin 4 for covering the entire surface of the power semiconductor element 1, the whole of the inner lead parts 5IL, 6IL of the external connection terminals 5, 6, and the whole of the external surface 7OS of the conductive pipe 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
