| 摘要 |
PROBLEM TO BE SOLVED: To provide a washing method of semiconductor substrate for enabling delicate washing process, only with simplified dillution by water in accordance with the size of wiring width and amount of deposition, of the semiconductor substrates in different sizes of the wiring width having excellent deposition peeling property and corrosion-proof characteristic of wires, and also to provide a method of manufacturing a semiconductor substrate or semiconductor element utilizing the same washing method. SOLUTION: The washing method of semiconductor substrate is characterized in using a non-fluorine system peeling agent substance of pH 10 or less including at least the water of 20 weight % and the peeling agent by dilluting the same substance with the water when the same substance is used, and the method of manufacturing semiconductor substrate or semiconductor element includes the step of washing the same semiconductor substrate or semiconductor element. COPYRIGHT: (C)2005,JPO&NCIPI |
