PROBE CARD AND CONTACT USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure of contacts to be in contact with a semiconductor device on a probe card for measuring various electrical characteristics of semiconductor devices such as LSI chips. SOLUTION: The probe card has a contact mounting substrate to which a plurality of the contacts are mounted. The contacts each comprises insertion parts for mounting to the contact mounting substrate; a support part for supporting the insertion parts and positioning in a height direction by contact with the surface of the contact mounting substrate; an arm part extended from the support part; and a contact part arranged on the tip side of the arm part to be in contact with electrodes of an object to be inspected. The insertion parts are detachably mounted to electrode holes provided for the surface of the contact mounting substrate and communicating via wiring patterns. COPYRIGHT: (C)2005,JPO&NCIPI