POLYAMIDE RESIN AND POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION COMPRISING IT, SEMICONDUCTOR DEVICE AND DISPLAYING ELEMENT USING THEM, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND DISPLAYING ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a polyamide resin excellent in resistance to hydrofluoric acid for the purpose of producing either a polybenzoxazole resin or a polyimide resin, or a copolymer resin of both resins, to provide a positive type photosensitive resin composition excellent in developing characteristics using the polyamide resin, to provide a semiconductor device and a displaying element and to provide a process for producing the semiconductor device and the displaying element.

SOLUTION: The polyamide resin is a polyamide resin (A) which has a structure represented by formula (1) wherein 0.1-30 mol% of the total amount of Y in formula (1) is constituted of a structure represented by formula (2). The photosensitive resin composition comprising the polyamide resin is provided and the semiconductor device using the polyamide resin and the photosensitive resin composition is provided.

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