发明名称 WIRING SUBSTRATE CARRIER
摘要 <P>PROBLEM TO BE SOLVED: To provide a fixture or a carrier to fix a thin or a fine printed circuit board by adhesion force. <P>SOLUTION: The fixture or the carrier which fixes a wiring substrate comprises a positioning plate of a conductive material that includes one or more through portions adapted to a contour of a contact surface of the wiring substrate, and an adhesive layer-containing plate that is constituted by one or more metal plates and that has an adhesive layer at one side, wherein a surface of the adhesive layer side of the adhesive layer-containing plate has a means to provide a contact face to contact with one face of the positioning plate and to contact with at least one portion of the contact face of the wiring substrate, and to prevent accumulation of static electricity while the adhesion layer-containing plate retains the adhesion force for the adjoining positioning plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072556(A) 申请公布日期 2005.03.17
申请号 JP20040108308 申请日期 2004.03.31
申请人 KENSEIDOU KAGAKU KOGYO KK;MATSUI DENKI SANGYO KK 发明人 FUJITA TAKASHI;SOTODATE KIMIO
分类号 H05K13/02;H05K3/34 主分类号 H05K13/02
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