| 摘要 |
PROBLEM TO BE SOLVED: To provide a silica-based film forming composition and the like, which forms a silica-based film excellent in mechanical strength such as sufficient CMP (chemical mechanical polishing) resistance, low dielectric properties, and adhesive properties. SOLUTION: The silica-based film forming composition comprises (a) a siloxane resin of an alkoxysilane and the like, excluding F atom-containing trialkoxysilane, as a constituent (the total content proportion of at least one kind of atom selected from a group of H atom, F atom, B atom, N atom, Al atom, P atom, Si atom, Ge atom, Ti atom, and C atom, is 0.65 mol based on 1 mol of the Si atom), (b) a solvent such as an alcohol that can dissolve the siloxane resin as a constituent, and (c) an onium salt such as an ammonium salt as a constituent. COPYRIGHT: (C)2005,JPO&NCIPI
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