摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a via plug having no long process and long construction period and lowering a manufacture cost, by having no irregular height of a via-plug and simplifying a formation method of the via plug in the manufacturing method of the via plug used as input and output terminals with a semiconductor device in a wiring board for the semiconductor device, and to provide the via plug for improving connection with a soldering ball during packaging. SOLUTION: The method for manufacturing the via plug comprises a process for manufacturing a via hole in an insulation base material consisting of an insulating material, a process for manufacturing a projection-shaped via structure by using a photo-etching method of a photo-process on a semiconductor base material consisting of a conductive material, and a process for fitting and sticking the conductor base material consisting of the conductive material forming the projection-shaped via structure and the insulation base material consisting of the insulating material molding the via-hole with the via-structure and the via hole. COPYRIGHT: (C)2005,JPO&NCIPI
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