发明名称 |
SURFACE STATE MEASURING METHOD OF SURFACE PROCESSED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a surface state measuring method of a surface processed product which enables an evaluation of the surface state of the surface processed product in a non-destructive state. SOLUTION: The surface of an object 1 to be measured is irradiated with a pressure wave 4 so as to generate a Rayleigh wave 4b in the vicinity of the surface of the object 1 and the reflected wave 5 from the surface irradiated with the pressure wave 4 of the object 1 is detected while the leakage wave 7 from the object 1 based on the Rayleigh wave 4b is detected. The thickness of the crack layer 1a of the object 1 is measured on the basis of the reflected wave 5 and the leakage wave 7. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005069782(A) |
申请公布日期 |
2005.03.17 |
申请号 |
JP20030297868 |
申请日期 |
2003.08.21 |
申请人 |
MURATA MFG CO LTD |
发明人 |
INAO TAKESHI;TOKUNAGA YUICHIRO |
分类号 |
G01B17/02;G01N29/00;(IPC1-7):G01N29/18 |
主分类号 |
G01B17/02 |
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