THIN BOND-LINE SILICONE ADHESIVE COMPOSITION AND METHOD FOR PREPARING THE SAME

摘要

Thermal interface compositions (20) contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with a polyme r matrix. Such compositions enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between thermal interface materials (20) and the corresponding mating surfaces.