| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for fixing a semiconductor discrete part which can reduce a size by suppressing overheating of the semiconductor discrete part, and to provide a discrete semiconductor device. <P>SOLUTION: The discrete semiconductor device 1 includes a structural material 2 built on a protruding part 3 of substantially the same height as the upper surface of the semiconductor discrete part 51 provided at the end of a heatsink 52, in such a manner that the structural material 2 and the protruding part 3 of the heatsink 52 are fixed with a metallic screw 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
