发明名称 PACKAGING METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To improve productivity by reducing time required for acquiring substrate information in a packaging process for packaging by using a plurality of packaging facilities. <P>SOLUTION: In a method for sequentially packaging components by a plurality of packaging facilities A1-A4, based on substrate information required for packaging acquired by the image recognition of marks given to each unit substrate to assembly substrates 1-5, where a plurality of unit substrates are divided and formed, the substrate information of the assembly substrates is transmitted to the succeeding packaging facilities for dispensing with the image recognition of marks at the succeeding packaging facilities A2-A4 when acquiring the substrate information in the packaging facilities A1 for packaging first and carrying the assembly substrates 1-5 from arbitrary packaging facilities A1-A4 to the succeeding packaging facilities A2-A4. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072317(A) 申请公布日期 2005.03.17
申请号 JP20030301032 申请日期 2003.08.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MURATA KAZUHIRO;KITAGAWA HIROMOTO;OMURA TAKASHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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