| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and the semiconductor device which has a POP structure and is suitable for mass production. <P>SOLUTION: A plurality of first semiconductor packages 11 are simultaneously arranged on a base substrate 51. A plurality of second semiconductor packages 31 are simultaneously arranged on the base substrate 51. Furthermore, the base substrate 51 is so divided along cutting plane lines 81 that at least each one piece of the first semiconductor packages 11 and each one piece of the second semiconductor packages 31 are included, thereby manufacturing the semiconductor device which has the POP structure. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
