| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a metallic frame body is brazed to a wiring board composed of a ceramic material, the whole body of a package for housing electronic component warps after being brazed due to the coefficient of thermal expansion of the frame body larger than that of the wiring board and it becomes difficult to attach a lid body to the top surface of the frame body. SOLUTION: Since the package 7 for housing electronic component is provided with a second metallic frame body 3 joined to the bottom surface of an insulating substrate 1 so that the body 2 may overlap a first metallic frame body 2 in the top view, it can be prevented effectively by the second metallic frame body 3 that the insulating substrate 1 is pulled by the first metallic frame body 2 and warps due to the difference in thermal expansion between the substrate 1 and frame body 2. As a result, the lid body 4 can be joined surely to the top surface of the first metallic frame body 2 provided on the insulating substrate 1 and the airtightness reliability of the package 7 housing an electronic component 8 can be improved. Consequently, the package 7 for housing electronic component which is excellent in airtightness reliability can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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