| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which reduces mark regions in a lithography step and obtains a high aligning accuracy. SOLUTION: The method comprises a step of forming alignment marks 1 together with a device pattern on a semiconductor wafer, a step of coating the semiconductor wafer with resist, a step of aligning exposure positions according to the alignment marks 1, and a step of exposing specified regions to form alignment deviation measuring marks 2 at specified positions near the alignment marks 1 together with a resist pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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