发明名称 MANUFACTURING METHOD OF SOLID IMAGE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid image element having a sufficient sensitivity while suppressing variation in sensitivity. SOLUTION: The method of manufacturing a solid image element comprises a step for forming the semiconductor region 14 of a light receiving sensor section 4 on the semiconductor layer 21 of a wafer 20 having a substrate 24 formed by laying a semiconductor substrate 23, an intermediate layer 22 and the semiconductor layer 21, a step for forming a wiring layer 13 on the surface of the semiconductor layer 21, a step for forming a groove 25 in the semiconductor substrate 23 on the rear side of the wafer 20, and a step for removing the intermediate layer 22 and the semiconductor substrate 23 by supplying etching liquid from the groove 25 thereby etching the intermediate layer 22. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005072060(A) 申请公布日期 2005.03.17
申请号 JP20030209094 申请日期 2003.08.27
申请人 SONY CORP 发明人 NAGAHAMA YOSHIHIKO
分类号 H01L27/146;H01L27/14;H01L31/10;(IPC1-7):H01L27/146 主分类号 H01L27/146
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