ISOSTATIC PRESSURE ASSISTED WAFER BONDING METHOD

摘要

In the invention, wafers are initially weakly bonded. The weak bond is sufficient to impede penetration of an isostatic pressure transmitting media, e.g., a gas or liquid, into any region between the wafers. The weak bond also permits handling. Weak bonds are strengthened, or new bonds formed, by heating and pressing together the weakly bonded wafers by application of isostatic pressure. By the invention, weak interfacial bonds may be strengthened.