发明名称 |
Device package and methods for the fabrication and testing thereof |
摘要 |
Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component. |
申请公布号 |
EP1515364(A2) |
申请公布日期 |
2005.03.16 |
申请号 |
EP20040255517 |
申请日期 |
2004.09.13 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. |
发明人 |
SHERRER, DAVID W.;RASNAKE, LARRY J.;FISHER, JOHN J. |
分类号 |
H01L23/02;G01R31/26;G02B6/36;G02B6/42;H01L21/28;H01L21/66;H01L23/48;H01L29/22;H01L33/00;H01S5/00;H01S5/022;H01S5/024 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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