CLEANER FOR USE IN SEMICONDUCTOR EQIUPMENT

摘要

A cleaning apparatus of semiconductor manufacturing equipment is provided to restrain the degradation of a polishing pad and to remove effectively a predetermined layer from a wafer by using spraying nozzles capable of supplying a cleaning solution onto the polishing pad from center to edge. A cleaning apparatus includes a rotatable arm, a plurality of first nozzles and a second nozzle. The rotatable arm(204) is installed over a polishing pad. The plurality of first nozzles(206) are attached to a lower portion of the arm in a length direction in order to spray a predetermined fluid to the polishing pad. The second nozzle(208) for spraying the fluid to even the center of the polishing pad is attached to an outer end of the arm.