An integrated circuit card and a method of manufacturing the same

摘要

A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. A body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. An opposite side (opposite to the chip mounting side) of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of the molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.