Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
申请公布号
EP1097477(A4)
申请公布日期
2005.03.16
申请号
EP19990927222
申请日期
1999.06.04
申请人
JOHNSON MATTHEY ELECTRONICS INC
发明人
SMITH, CHARLES;CHAU, MICHAEL, M.;EMIGH, ROGER, A.;DEAN, NANCY, F.