发明名称 |
METHOD FOR PRODUCING A CHIP CARD MODULE |
摘要 |
Flip-chip bumps (solder bumps) are applied on the contact-connection points of a semiconductor chip. These bumps extend from there through a covering compound (mold) that is applied as a protective layer. The end of each one of the bumps that is remote from the semiconductor chip forms a pad. This pad lies approximately plane-parallel in the surface of the covering compound that is remote from the semiconductor chip. At least during the encapsulation process, the chips are preferably arranged on a carrier element, in particular a carrier strip. |
申请公布号 |
EP1212726(B1) |
申请公布日期 |
2005.03.16 |
申请号 |
EP20000965790 |
申请日期 |
2000.08.24 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
PUESCHNER, FRANK;HEINEMANN, ERIK;FISCHER, JUERGEN |
分类号 |
H01L23/28;G06K19/077;H01L21/56;H01L21/60;H01L23/12 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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