发明名称 ONE-PACK MOISTURE-CURING EPOXY RESIN COMPOSITION
摘要 A one-pack moisture curable epoxy resin composition which has balanced contradictory properties, i.e., has excellent storage stability without impairing quick curability, and can be cured at room temperature. The composition is a one-pack moisture curable epoxy resin composition comprising: one or two or more compounds selected from the group consisting of a vinyl carboxylate compound represented by a chemical formula (1) and a silyl compound represented by a chemical formula (2) which has an epoxy group in an organic group, one or two or more compounds selected from the group consisting of a ketimine compound and an oxazolidine compound, and an epoxy resin: <CHEM> wherein R1, R2, R3 and R4 are each a hydrogen atom or an organic group and they may be the same or different, and n is an integer of 1 or more, and <CHEM> wherein R5 and R6 are each an alkyl group and they may be the same or different, R7 is an organic group having an epoxy group, and n is an integer of 1 to 3.
申请公布号 EP1362877(A4) 申请公布日期 2005.03.16
申请号 EP20010271409 申请日期 2001.12.17
申请人 KONISHI CO., LTD. 发明人 ENDO, TAKESHI;SANDA, FUMIO;HORII, HISAKAZU;SUZUKI, KENTARO;MATSUURA, NOBUKI
分类号 C07F9/38;C08G59/40 主分类号 C07F9/38
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