| 摘要 |
A lead frame structure and a semiconductor package using the same are provided to increase the number of input/output and to enhance heat dissipation effect by using an enhanced support member. A lead frame structure includes a support member(110) for loading stably a semiconductor chip, a plurality of tie bars, a plurality of pin type inner leads, an outer lead(140) prolonged from each inner lead to the outside, and dam bars. The support member is composed of a nonconducting lower tape pad, a conductive lead, and a nonconducting upper tape pad. Each tie bar(120) for supporting and fixing the support member is connected with a corner of the support member. The plurality of pin type inner leads(130) are spaced apart from the support member and connected with input/output terminals of the chip by using conductive wires. Each dam bar(150) is vertically connected with the inner and outer leads.
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