WAFER SAWING METHOD,申请号KR19970039916-传众专利搜索

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发明名称	WAFER SAWING METHOD
摘要
申请公布号	KR100478678(B1)	申请公布日期	2005.03.15
申请号	KR19970039916	申请日期	1997.08.21
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	JUNG, MYEONG GI;HONG, IN PYO;KIM, YONG;HAN, CHANG HUN
分类号	H01L21/66;(IPC1-7):H01L21/66	主分类号	H01L21/66
代理机构		代理人
主权项
地址

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