发明名称 |
Interference mitigation through conductive thermoplastic composite materials |
摘要 |
An electromagnetic radiation interference mitigation shield is provided for an electronic circuit component. The shield includes a body formed from an electrically and thermally conductive composite material characterized by a volume resistivity ranging from about 0.1 to about 1,000 ohm-cm and a thermal conductivity ranging from about 10x10<-4>-cal.-cm./sec.-cm.<2>-° C. to about 30x10<-4>-cal.-cm./sec.-cm.<2>-° C.
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申请公布号 |
US6866908(B2) |
申请公布日期 |
2005.03.15 |
申请号 |
US20030387808 |
申请日期 |
2003.03.12 |
申请人 |
PARKER-HANNIFIN CORPORATION |
发明人 |
LICHTENSTEIN PARKER ROSS;PENG HONG |
分类号 |
H01L23/373;H01L23/552;H05K9/00;(IPC1-7):H05K9/00 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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